Luxeon K2 LED Datasheet and The Reflow Soldering Characteristics
Luxeon K2 LED Datasheet and The Reflow Soldering Characteristics - This is the graphical type of the Philips Luxeon K2 LED – the latest Luxeon high-power LED family Reflow Soldering Luxeon K2 LED Reflow Soldering CharacteristicsCharacteristics.
The Luxeon K2 enable you with more useable light, reduce thermal management engineering, simplify manufacturing via the use of surface mount technology.
The profile feature of Luxeon K2 based on its soldering characteristics are: Tsmax=200°C, Tsmin=150°C, Tsmin to Tsmax (preheat time)=60 – 180 seconds, Average Ramp-Up Rate=3°C / second max,
Time Maintained Above Temperature (TL)=217°C, Time Within 5°C of Actual Peak Temperature (TP)=20 – 40 seconds, Ramp-Down Rate=6°C / second max, and Time 25°C to Peak Temperature=8 minutes max.
It is noted in the Luxeon K2 datasheet that all temperatures refer to topside of the package which is measured on the package body surface.
You will require an electrical isolation between signal leads and hexagonal heat slug contact. Maximizing board metalization at the heat slug contact can be performed for an optimal thermal performance.
You also can find 4-lead Gullwing Solder Pad Design and Layout within the datasheet (source: philips.com).
Tags: philips luxeon, Soldering, Characteristics, LED Datasheet, Solder Pad Design